COPPER PLATING (Acidic & Alkaline)

I. ACIDIC COPPER PLATING

“Copper 70” bath is an outstanding copper sulphate plating process, produces mirror bright, highly leveled and ductile copper deposits ,

it provides the following benefits:

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ADVANTAGES
1. It is a Dye-Free acid copper process.
2. It is the fastest copper process.
3. It gives high leveling power.
4. It produces mirror finish, despite the fairly rough surface condition of the basis metal.
5. It has an exceptional throwing power.
6. It results in a ductile deposit which absorbs mechanical and thermal stresses in nickel plating.
7. It is highly economic.
8. It has an appreciated ductility for electroplated plastics.
9. It works with absence of initial stresses even at thick deposits
10. It is high tolerance to over feeding.
11. It has excellent tolerance to impurities.
12. It operates at low C.D.
13. It resists contamination; it doesn't form breakdown products which have to be carbon treated as with dye baths.
14. It is not loaded with organics.
15. It has anti-burn properties.
16. It has anti-treeing properties.
17. It works with single addition (as well as wetting agent).

 

II. ALKALINE COPPER PLATING
“Copper Y” is a bright cyanide copper plating process for decorative & functional applications,

it provides the following benefits:

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ADVANTAGES
1. Bright deposits after shortest plating time.
2. Fast deposition speed at elevated temperatures.
3. Uniform color deposits.
4. Fair leveling over a wide current density range.
5. Suitable for barrel and rack plating onto multiple substrates.
6. Used for plating on: steel, zinc-die-castings and zinc coated aluminum.
7. Excellent brightness & throwing power at lowest current densities.
8. Sodium & potassium based formulations, O.K.
9. Easy to use additives with clear defined properties, therefore, very easy trouble shooting reatment.
10. Very economic.

 

"Copper" system consists of the following items:

  • “Copper 51 Y”: Base Additive.
  • “Copper 52 Y”: Maintenance Additive, Brightener & Leveler.